Industry
Test Probes & POGO Pins for Semiconductor Testing
Ultra-Fine Pitch Probe Pins for Sub-Micron Wafer Probing & High-Speed IC Sorting
In modern semiconductor manufacturing, testing nanometer-node microchips demands extreme electrical precision, ultra-low contact resistance, and millions of reliable touchdowns without probe tip deformation.
Applications
- Wafer Probe Cards & Die Sorting
- High-Frequency BGA / QFN IC Test Sockets
- Memory Chip (3D NAND / HBM) Burn-In Testing
- Automotive Grade Microcontroller Qualification
The challenge
Penetrating tough native aluminum/copper oxide layers while maintaining sub-0.35mm pitch spacing and <15mΩ resistance.
EMSGLOB approach
EMSGLOB rhodium-plated and gold-alloy micro-probes with custom plunger crown profiles provide razor-sharp oxide penetration and superior signal integrity up to 40 GHz.
Recommended products
Fine Pitch Test Probes
Fine pitch probes are slim spring contacts for densely populated boards and components, where test points sit very close together.
32 series · 224 part numbers
Test Interface & Fixture Solutions
Interface and fixture solutions connect a tester to the fixture or the device in a modular way: interface probes and rigid probes for receivers, blocks for ICT fixtures, exchangeable cassettes, mechanical fixtures and pogo towers and interposers for semiconductor test.
12 series · 56 part numbers
Kelvin (4-Wire) Test Probes
Kelvin probes combine a force contact and a separate sense contact in one probe, so that a four-wire measurement can be made through a single test point.
11 series · 54 part numbers
ICT/FCT Spring Test Probes
Spring-loaded test probes form the contact between an in-circuit (ICT) or functional (FCT) tester and the board under test.
149 series · 3372 part numbersFrequently asked questions
Which EMSGLOB probes are used for semiconductor testing?
For semiconductor & ic testing EMSGLOB lists: Fine Pitch Test Probes, Test Interface & Fixture Solutions, Kelvin (4-Wire) Test Probes, ICT/FCT Spring Test Probes.
What are typical semiconductor testing applications?
Wafer Probe Cards & Die Sorting; High-Frequency BGA / QFN IC Test Sockets; Memory Chip (3D NAND / HBM) Burn-In Testing; Automotive Grade Microcontroller Qualification.
What is the main contact challenge in semiconductor testing?
Penetrating tough native aluminum/copper oxide layers while maintaining sub-0.35mm pitch spacing and <15mΩ resistance.
How does EMSGLOB address it?
EMSGLOB rhodium-plated and gold-alloy micro-probes with custom plunger crown profiles provide razor-sharp oxide penetration and superior signal integrity up to 40 GHz.
How do I request a quote or a custom probe?
Send your requirements through the RFQ form on the contact page, email sales@emsglob.com or call +91-7383235369. Drawings in STEP, IGES, PDF, DWG, DXF or ZIP format can be attached.
Need a quote or a custom probe?
Send your drawing, pitch, current and travel requirements to the engineering team. The RFQ form accepts STEP, IGES, PDF, DWG, DXF and ZIP files.